A New Advanced IC Packaging Report

While the economy has been faltering, demand for low-cost electronics such as tablets, smart cell phones, and more pulled the semiconductor industry ahead of the rest of the economy in the second half of 2009. What has been the role of IC packaging in this?

Advancements in IC packaging have allowed the final product to become smaller, cheaper, and thus more desirable to the final customer. In the newly published report, Advanced IC Packaging Technologies and Markets by NVR, (www.newventureresearch.com), the following areas of advanced IC packaging are discussed in length, including forecasts of units, pricing, and revenue.

• Stacked IC Packaging
• Through Silicon Vias (TSVs)
• System in Package (SiP)
• Wafer Level Packages (WLPs) including Fan-out WLPs
• Staggered Inner-Row QFNs
• Interconnection, including Flip Chip

Through silicon vias, while still a ways off in terms of implementation, have promise in a number of markets, including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips. Flash is another potential market for this technology. TSVs and the market size potential are discussed in length in this report.

Other findings in this report include:

― Stacked packages will grow from 2.6 billion in 2009 to 5.5 billion in 2014

― SiPs will grow from 1.4 billion in 2009 to nearly 3 billion in 2014

― WLPs will grow from 6.8 billion in 2009 to 16.8 billion in 2014;

― Fan Out WLPs will expand from 2.9 percent of that in 2009 to 6 percent in 2014

― QFNs will grow from 10 billion in 2009 to 22 billion in 2014;

― Staggered inner-row QFNs will expand from less than 1 percent in 2009 to 6 percent in 2014

For more information see www.newventureresearch.com, or contact Karen Williams, at kwilliams@newventureresearch.com, phone (408) 244-1100, fax (408) 864-2138, or the principal analyst Sandra Winkler, at slwinkler@newventureresearch.com, phone (650) 299-9365.

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