Advanced IC Packaging Technologies and Markets –
2012 Edition –
A Strategic Report On The Latest Technologies in IC Packaging With Forecasts of Key Markets

Price $3495—Published November 2011, 225 pages

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Although IC shipments dropped significantly in 2009, this is merely a dip in the road. Volumes have already begun to move upward again, and customers will require an ever-increasing portfolio of advanced IC packaging technologies.

New Venture Research (NVR) in its latest report, Advanced IC Packaging Technologies and Markets, 2012 Edition, uses information from IC packaging industry insiders to present the most realistic forecasts available regarding advanced IC packaging.  Throughout the report, the latest advanced packaging products, services, and research from numerous companies and organizations are described.

Chapter 3, The State of the Industry, begins with NVR’s views on the state of the semiconductor industry. This includes a look at global economic factors that impact the industry. NVR’s base semiconductor forecast and a mid-year update to that forecast are also provided.

Chapter 4, Wafer-Level Packages (WLPs), presents important WLP designs that have been introduced over the past year. WLP forecasts by pitch, I/O range, and IC product are given.

Chapter 5, Stacked Packages, explains the basics of this critical packaging technology, along with a sampling of the latest products. Forecasts include units, prices, packaging revenue, package types, device types, first-level interconnection, and applications. Through-silicon via (TSV) technology is discussed in depth.

Chapter 6, System in Package (SiP), presents information on the evolving market for ICs combined with passive devices within a single package. Forecasts include units, prices, packaging revenue, device types, interconnection, and applications.

Chapter 7, Interconnection, Flip Chip, and Bumping, contains a review of first-level package interconnection. Flip chip forecasts are provided, both within the package and as bare die on the PCB. Trends in wafer bumping are discussed extensively. Unit forecasts are given for bump styles, UBM processes, and bump composition.

Chapter 8, Array QFNs, reviews the latest designs in these new packages. Market forecasts include units, average I/O count, price per I/O, average assembly price, and revenue.

Chapter 9, Optical Interconnect, presents the current state of this exciting packaging technology of the future. The market potentials of both interchip and intrachip photonics are explored.

Trends in advanced IC packaging are important to your business. Advanced IC Packaging Technologies and Markets will provide you with an effective and economical tool for assessing the future of this market. The report sells for $2495, with extra copies $350. Each copy includes both a hardbound version and a single-user PDF file on CD-ROM. Corporate licensing is available—contact us for pricing.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

World Economic Outlook

2009 Base Forecast

Third-Quarter Update

Chapter 4: Wire Bonding

Wire Bonding Methods

Product Highlights


Units by Package Family

Wire Usage by Package Family,
Wire Material, and Wire Thickness

Wire Revenue by Material

Chapter 5: Leadframes

Plating Finishes

Product Highlights


Units by I/O Range, Pitch, and Plating Finish

Revenue by Size and Plating Finish

Chapter 6: Substrates




Flex Tape

Embedded Passives

Thermal Substrates

Product Highlights


Units, Area, Revenue by Package Family

Units, Area, Revenue by Material

Chapter 7: Solder Spheres

Preformed Solder Spheres

Product Highlights


Total Spheres by Package Family, Size , and Material

Revenue by Material

Chapter 8: Underfill

Underfill Types

Product Highlights


Underfilled Packages by Package Family

Underfill by Method

Chapter 9: Molding and Encapsulation


Product Highlights


Mold Compound by Package Family

Mold Compound Revenue

Partial List of Figures and Tables

IC Packaging Material Revenue Summary, 2008–2013


Nominal GDP of Major Countries and Regions

Real GDP Growth for Selected Countries

IC Units and Revenue, 2008–2013

Summary IC Unit Forecast by Product, 2008–2013


Wire Bonded ICs by Package Family, 2008–2013

Bonding Wire Usage by Package Family, 2008–2013

Bonding Wire Usage by Thickness, 2008 vs. 2013

Bonding Wire Usage by Material, 2008–2013

Bonding Wire Prices and Revenue, 2008–2013


Leadframe Packages by I/O Range, 2008–2013

Leadframes Divided by Size, 2008–2013

Leadframe Pitch, 2008–2013

Leadframe Plating Finish, 2008–2013

Cost per Leadframe, 2008–2013

Total Leadframe Revenue, 2008–2013


PGA Units by I/O Pitch, 2008–2013

BGA Units by I/O Pitch, 2008–2013

FBGA Units by I/O Pitch, 2008–2013

WLP Units by I/O Pitch, 2008–2013

PGA Substrates, 2008–2013

BGA Substrates, 2008–2013

FBGA Substrates, 2008–2013

Substrate Unit Summary, 2008–2013

Average Substrate Area by Package Type, 2008–2013

Substrate Area by Package Type, 2008–2013

Substrate Area Summary, 2008–2013

Average Substrate Price, 2008–2013

Substrate Revenue by Package Type, 2008–2013

Substrate Revenue Summary, 2008–2013


Solder Spheres by Package Type and

Sphere Size, 2008–2013

Solder Spheres by Material, 2008–2013

Solder Sphere Pricing by Material, 2008–2013

Solder Sphere Revenue by Material, 2008–2013


Underfilled Packages by Package Family, 2008–2013

Underfilled Packages by Underfill Type, 2008–2013

Underfill Quantity, 2008–2013

Price per Gram for Underfill, 2008–2013

Underfill Revenue, 2008–2013


Encapsulated ICs, 2008–2013

Mold Compound Usage by Package Family, 2008–2013

Mold Compound Halogen-Free Transition, 2008–2013

Mold Compound Price, 2008–2013

Mold Compound Revenue, 2008–2013

The latest advanced packaging
products, services, and research of the following companies and
organizations are interspersed throughout the report:

  • AIST
  • Amkor
  • ASAT
  • Auburn University
  • Bridgewave Communications
  • Cornell University
  • CVInc
  • Engent
  • FlipChip International
  • Fraunhofer IZM
  • Georgia Tech.
  • Ghent University
  • Hong Kong University
  • Ibiden
  • IBM
  • IME
  • IMEC
  • Intel
  • Intelligent Chip Connections
  • Interconnect Systems
  • ITRI
  • Luxtera
  • Mitsui High-tec
  • NEC
  • Reflex Photonics
  • RTI
  • Samsung
  • Sandia Labs
  • Sanyo
  • Shinko Electric
  • Soitec
  • STMicroelectronics
  • Sun Microsystems
  • Tessera
  • UCLA
  • University of Texas

Price $2495—Published September 2009, 225 pages

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