The Worldwide Electronics IC, PCB & Box Assembly Application Markets – 2011 Edition

The worldwide electronics manufacturing assembly market continued to recover significantly in 2010. After a painful downturn, the market experienced significant growth in semiconductor sales and assembly value (COGS – cost of goods sold). All indications are that this growth will continue into and beyond 2015.

New Venture Research (NVR) has followed the electronics assembly industry for over 20 years with numerous research reports focusing on all the players and product assemblies in the electronics industry. Now, NVR is pleased to offer, The Worldwide Electronics IC, PCB & Box Assembly Application Markets – 2011 Edition. This unique database provides 2010 global IC electronics and assembly data by its individual components (semiconductor ICs, passives, discretes, labor/overhead (e.g. PCB assembly value), plus box assembly value) for 46 different product applications. This database is supported with a Word file commentary discussion of the growth market trends of the leading products. This database provides the foundation for NVR’s other reports in electronics packaging and electronics product assembly by supplier (OEM, EMS, ODM). This report is the foundation by which our other packaging and assembly market reside providing a complete understanding of the cost elements for leading electronics products including IC semiconductor, PCB board and Box assembly cost elements in the leading electronics product assembly application markets. The database divides the global electronics industry into seven critical market segments including:

  • Automotive
  • Communications Computers /Peripherals
  • Consumer Electronics
  • Industrial
  • Medical
  • Aerospace/Military/Other Transportation

A discussion of each market application and the trends is included with the database in a Word document. Each market segment and individual product application is reviewed for semiconductor, PCB and Box costing trends.

The Worldwide Electronics IC, PCB & Box Assembly Application Markets – 2011 Edition, will provide the critical information you need on electronics COGS assembly. The Excel and Word files are shipped by email as a single-user license priced at $2,995. An extra single user license is $250 and a corporate license is $1000.  See our website at for obtaining a detailed brochure.

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The Merchant Embedded Computing Market – 2011 Edition

The Merchant Embedded Computing Market – 2011 Edition report analyzes the performance of the industry from 2002 – 2015.  Although there are several hundred companies, most are fairly small in revenue and highly specialized, focusing on specific application segments with unique product requirements.  The report tracks and analyzes five application markets, nine bus architectures and four form factors.  Specific trends and issues of the forecast by application, bus architecture and form function are covered in detail in the report.

Whereas the overall MEC market is slowly recovering from the trauma of 2009’s economic meltdown, the performance of various market segments, bus architectures, and companies will recover at different rates.  Total revenue was just under $5 billion in 2010, a 4 percent increase from 2009 revenue which had a 12-14 percent decrease over 2008.  If the worldwide economies stablize, the MEC industry will likely recover at about 6 percent in 2011 to ~$5.2 billion.

The MEC report targets five specific application markets: Communications, Industrial, Medical, Military/Aerospace and an Other category that includes transportation, security, surveillance, point-of-sale/kiosk applications, etc. The Communication wireless segment is being driven by smart phone traffic.  3G/4G services are where the money is for carriers going forward and the wireline and optical networks are gearing up for upgrades to support the ever increasing traffic.  The Industrial market particularly suffered from the financial crisis but investment in capital equipment infrastructure as well as test & measurement is starting to return.

The Medical segment was hit hard by the healthcare cutbacks which made purchasing MEC-based, large equipment much more difficult. The usually healthy Military/Aerospace segment is facing a rapidly declining defense department budget in the USA that is likely to cause a restructuring not seen since the end of the cold war.

Each architecture has a different rate of adoption depending on the needs of individual application segments.  Overall key trends are “Power is up and down; Green is the new color; and small is big.”  New 40 and 32-nm silicon for microprocessors, graphics, DSPs and high integration I/O chips pack a lot of processing power while greatly reducing power consumption.  High integration silicon and serial buses enable more small form factors (SFF) than in the past and are making many older, parallel bus structures, such as PCI, look like the bus architecture equivalent of a “clunker.”  Bus structures continue to proliferate around the major and long established busses but the number of variances is past 100.

The MEC industry can be segmented into four form functions defined as: single-board computers (SBC), digital signal processor (DSP) boards, I/O boards and an ‘All Other’ category that incorporates a huge number of diverse and specific functions. In some applications I/O boards are proliferating and are customized to the wide spectrum of I/O functions that different applications use.  In other applications, single-board computers are becoming the trend as they incorporate more and more functionality with advanced silicon and draw in DSP, graphics and many advanced I/O functions.

The Merchant Embedded Computing Market – 2011 Edition is more than 400 pages in length and is sold as a PDF file for $2995.  See our website at for a detailed brochure.

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The Worldwide Printed Electronics Market – 2010 Edition

Printed materials and conductive inks have begun to penetrate many established products and extend them in new ways. The most immediate applications concern RFID and OLED displays, which are manufactured using OTFT technology. These technologies are penetrating a wide number of customer applications, and as costs decline and performance improves, will justify customers switching to and, in many cases, implementing entirely new design solutions. Others applications, such as packaging, and photovoltaic and battery storage technology, are emerging slowly but represent great potential

For more information please contact:

Randall Sherman
New Venture Research Corp.
337 Clay St., Suite 101
Nevada City, CA 95959

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A New Advanced IC Packaging Report

While the economy has been faltering, demand for low-cost electronics such as tablets, smart cell phones, and more pulled the semiconductor industry ahead of the rest of the economy in the second half of 2009. What has been the role of IC packaging in this?

Advancements in IC packaging have allowed the final product to become smaller, cheaper, and thus more desirable to the final customer. In the newly published report, Advanced IC Packaging Technologies and Markets by NVR, (, the following areas of advanced IC packaging are discussed in length, including forecasts of units, pricing, and revenue.

• Stacked IC Packaging
• Through Silicon Vias (TSVs)
• System in Package (SiP)
• Wafer Level Packages (WLPs) including Fan-out WLPs
• Staggered Inner-Row QFNs
• Interconnection, including Flip Chip

Through silicon vias, while still a ways off in terms of implementation, have promise in a number of markets, including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips. Flash is another potential market for this technology. TSVs and the market size potential are discussed in length in this report.

Other findings in this report include:

― Stacked packages will grow from 2.6 billion in 2009 to 5.5 billion in 2014

― SiPs will grow from 1.4 billion in 2009 to nearly 3 billion in 2014

― WLPs will grow from 6.8 billion in 2009 to 16.8 billion in 2014;

― Fan Out WLPs will expand from 2.9 percent of that in 2009 to 6 percent in 2014

― QFNs will grow from 10 billion in 2009 to 22 billion in 2014;

― Staggered inner-row QFNs will expand from less than 1 percent in 2009 to 6 percent in 2014

For more information see, or contact Karen Williams, at, phone (408) 244-1100, fax (408) 864-2138, or the principal analyst Sandra Winkler, at, phone (650) 299-9365.

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