Advanced IC Packaging Technologies, Materials and Market – 2018 Edition

//Advanced IC Packaging Technologies, Materials and Market – 2018 Edition

Advanced IC Packaging Technologies, Materials and Market – 2018 Edition

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Description

The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today’s users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.

All of these forces are driving semiconductor companies to develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages. The last decade has seen an explosion of new products including fan-out wafer-level packaging (FOWLPs), stacked IC packages and complex system-in-packages (SiPs), as well as advances in package substrates, flip chip interconnection and through-silicon vias. All these advances are enabling significant improvements in packaging density and opening new market opportunities for manufacturers.

This latest report from New Venture Research (NVR), Advanced IC Packaging Technologies, Materials and Markets, 2018 Edition, reveals the latest technology and market trends in the IC packaging industry by focusing on the most advanced packaging products and solutions-those critical to success in developing cutting-edge products and in maintaining technological leadership. Every market or application segment discussed in the report includes quantitative analysis based on the most current historical years, 2016 and 2017, as well as forecasts from 2018 through 2022. Each of the six chapters examines the market from a different perspective.

Chapter 3: Overview of Worldwide IC Packaging Markets, outlines the major IC packaging market segments in terms of I/O count, device function and the key application markets for IC devices, including cellular phones, tablets, PC, DVD players, digital cameras, etc. This chapter also includes an overview of the major economic and industry trends driving the semiconductor sector, including mergers and acquisitions, and the impact from emerging markets such as the Internet of Things, artificial intelligence and machine learning. Market forecasts include units, prices, packaging revenue, package types and device types.

Chapter 4: Advanced IC Packaging Markets provides an in-depth discussion of the technologies and market trends of the semiconductor industry’s advanced packaging solutions:

Fan-out wafer-level packaging (FOWLP)
● Multi-row QFN packaging (Fan-out wafer-level packaging (FOWLP)
● Multi-row QFN packaging (MRQFN)
● Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
● System-in-packages (SiPs): package-on-packages, package-in-packages, multichip modules and stacked

WLPs used as components in SiPs This chapter analyzes the total market and individual market segments from a number of viewpoints, including their characteristics, functions, applications, technology, and the key challenges facing the various advanced packaging solutions. Numerous tables and figures provide detailed market data and forecasts for unit shipments, revenues, prices, I/O-count, and die usage. The chapter ends with an examination of the substrate materials and embedded components used in SiP assembly. Forecasts include package units, area of shipped materials, and substrate revenues.

Chapter 5: Interconnection Technologies and Solutions, provides a comprehensive examination of wire bonding and flip chip technology and market trends, and includes in-depth analysis of flip chip markets in terms of specific devices and packaging types. The chapter also examines the market potential of through-silicon vias (TSVs) for 2.5D and 3D packaging. The chapter tables and figures present unit shipments and revenue forecasts for each market segment.

Chapter 6: Advanced IC Packaging Company Profiles presents profiles of twenty advanced packaging companies from across the IC packaging spectrum, including large and small competitors from among OSATs, foundries, and IDMs. Each profile gives a short company background and presents examples of their advanced packaging products.

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