The Worldwide IC Packaging Market

New Venture Industry Reports

The Worldwide IC Packaging Market
2011 Edition

The Most Comprehensive Report Available
On The Global IC Packaging Industry


Price $2995—Published June 2011, 442 pages


Download brochure with order form


Synopsis

After an unprecedented five years of continuous market growth, the semiconductor industry faltered in late 2009 as the global economic crisis struck hard. So, where is the industry headed now and what are the implications for the IC packaging industry? New Venture Research (NVR), in the 2010 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market.

The report begins with NVR’s views on the state of the semiconductor industry, along with a top level forecast. This discussion includes factors bearing on individual semiconductor products as well as global economic factors. The financial performance of the publicly-traded SATS companies’ is also addressed.

Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.

Next, the report presents NVR’s continuing, extensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world’s IC packaging business. The report breaks the contractor market down by package families and major product categories, providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world’s largest contractors and the packages they offer.

The Worldwide IC Packaging Market, 2010 Edition continues NVR’s leadership position in assessing the status and future of IC packaging. This report will provide you with an effective and economical tool for assessing the future of this market. The report sells for $2995, with extra copies $250 each. This report is only available in PDF format and is delivered by email. Corporate licensing is available—contact us for pricing.


Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

Semiconductor Industry Analysis

SATS Company Financial Analysis

Global Economic Factors

Chapter 4: IC Package Forecast by Product

MPU

MCU

DSP

DRAM

Flash

SRAM

ROM and EPROM

EEPROM/Other Memory

Digital Bipolar

Standard Logic

Gate Arrays

Cell-Based and PLD

Display Drivers

Custom Logic

Amplifiers

Interfaces

Voltage Regulators

Data Converters

Custom Analog

Chapter 5: IC Package Forecast by Package Family

DIP

SOT

SO

TSOP

DFN

CC

QFP

QFN

PGA

BGA

FBGA

WLP

DCA

Chapter 6: Packaging Contractor Market

Market Overview

Forecasts by Package Family

DIP

SOT

SO

TSOP

DFN

CC

QFP

QFN

PGA

BGA

FBGA

WLP

Unit, Revenue, and Pricing Forecasts

Forecast by Product

Contractor Rankings

Chapter 7: Company Profiles

Amkor

ASE

Carsem

China Wafer Level CSP

ChipMOS

CORWIL Technology

EEMS

FlipChip Int’l

Fujitsu

Hana

Hana Micron

I2A

IDS Electronics

Infiniti

Jiangsu Changjiang

Lingsen

Millennium Micro

Naito Densei Kogyo

Nantong Fujitsu

NxGEN

OSE

Powertech

Shinko Electric

Signetics

Siliconware

SPEL

STATS ChipPAC

Tianshui Huatian Tech

Unisem

UTAC

Vigilant Technology

Wuxi China (Anst)

XinTec

Appendix A: Contractor Packages

Appendix B: Contractor Website Guide

Appendix C: Glossary

Appendix D: SATS Financial Data

Partial List of Figures and Tables

IC Unit Forecast

IC Revenue Forecast

IC Packaging Revenue Forecast

Price per I/O by Package Family

Package Price Forecasts

IC Product Forecasts

MPU

MCU

DSP

DRAM

Flash

SRAM

ROM and EPROM

EEPROM/Other Memory

Digital Bipolar

Standard Logic

Gate Arrays

Cell-Based and PLD

Display Drivers

Custom Logic

Amplifiers

Interfaces

Voltage Regulators

Data Converters

Custom Analog

DIP Forecasts—3 I/O Ranges

SOT Forecasts

SO Forecasts—3 I/O Ranges

TSOP Forecasts—3 I/O Ranges

DFN Forecasts—2 I/O Ranges

CC Forecasts—2 I/O Ranges

QFP Forecasts—2 I/O Ranges

QFN Forecasts—4 I/O Ranges

PGA Forecasts—2 I/O Ranges

BGA Forecasts—3 I/O Ranges

FBGA Forecasts—5 I/O Ranges

WLP Forecasts—4 I/O Ranges

DCA Forecasts—5 I/O Ranges

Total IC Packaging Revenue

Contractor Total Forecast

Contractor DIP Forecast

Contractor SOT Forecast

Contractor SO Forecast

Contractor TSOP Forecast

Contractor DFN Forecast

Contractor CC Forecast

Contractor QFP Forecast

Contractor QFN Forecast

Contractor PGA Forecast

Contractor BGA Forecast

Contractor FBGA Forecast

Contractor WLP Forecast

Packaging Contractor Rankings

 


 

Price $2995—Published June 2010, 442 pages


Download brochure with order form


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