The Worldwide IC Packaging Market
2011 Edition
The Most Comprehensive Report Available
On The Global IC Packaging Industry
Price $2995—Published June 2011, 442 pages
Download brochure with order form
Synopsis
After an unprecedented five years of continuous market growth, the semiconductor industry faltered in late 2009 as the global economic crisis struck hard. So, where is the industry headed now and what are the implications for the IC packaging industry? New Venture Research (NVR), in the 2010 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market.
The report begins with NVR’s views on the state of the semiconductor industry, along with a top level forecast. This discussion includes factors bearing on individual semiconductor products as well as global economic factors. The financial performance of the publicly-traded SATS companies’ is also addressed.
Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.
Next, the report presents NVR’s continuing, extensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world’s IC packaging business. The report breaks the contractor market down by package families and major product categories, providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world’s largest contractors and the packages they offer.
The Worldwide IC Packaging Market, 2010 Edition continues NVR’s leadership position in assessing the status and future of IC packaging. This report will provide you with an effective and economical tool for assessing the future of this market. The report sells for $2995, with extra copies $250 each. This report is only available in PDF format and is delivered by email. Corporate licensing is available—contact us for pricing.
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the Industry
Semiconductor Industry Analysis
SATS Company Financial Analysis
Global Economic Factors
Chapter 4: IC Package Forecast by Product
MPU
MCU
DSP
DRAM
Flash
SRAM
ROM and EPROM
EEPROM/Other Memory
Digital Bipolar
Standard Logic
Gate Arrays
Cell-Based and PLD
Display Drivers
Custom Logic
Amplifiers
Interfaces
Voltage Regulators
Data Converters
Custom Analog
Chapter 5: IC Package Forecast by Package Family
DIP
SOT
SO
TSOP
DFN
CC
QFP
QFN
PGA
BGA
FBGA
WLP
DCA
Chapter 6: Packaging Contractor Market
Market Overview
Forecasts by Package Family
DIP
SOT
SO
TSOP
DFN
CC
QFP
QFN
PGA
BGA
FBGA
WLP
Unit, Revenue, and Pricing Forecasts
Forecast by Product
Contractor Rankings
Chapter 7: Company Profiles
Amkor
ASE
Carsem
China Wafer Level CSP
ChipMOS
CORWIL Technology
EEMS
FlipChip Int’l
Fujitsu
Hana
Hana Micron
I2A
IDS Electronics
Infiniti
Jiangsu Changjiang
Lingsen
Millennium Micro
Naito Densei Kogyo
Nantong Fujitsu
NxGEN
OSE
Powertech
Shinko Electric
Signetics
Siliconware
SPEL
STATS ChipPAC
Tianshui Huatian Tech
Unisem
UTAC
Vigilant Technology
Wuxi China (Anst)
XinTec
Appendix A: Contractor Packages
Appendix B: Contractor Website Guide
Appendix C: Glossary
Appendix D: SATS Financial Data
Partial List of Figures and Tables
IC Unit Forecast
IC Revenue Forecast
IC Packaging Revenue Forecast
Price per I/O by Package Family
Package Price Forecasts
IC Product Forecasts
MPU
MCU
DSP
DRAM
Flash
SRAM
ROM and EPROM
EEPROM/Other Memory
Digital Bipolar
Standard Logic
Gate Arrays
Cell-Based and PLD
Display Drivers
Custom Logic
Amplifiers
Interfaces
Voltage Regulators
Data Converters
Custom Analog
DIP Forecasts—3 I/O Ranges
SOT Forecasts
SO Forecasts—3 I/O Ranges
TSOP Forecasts—3 I/O Ranges
DFN Forecasts—2 I/O Ranges
CC Forecasts—2 I/O Ranges
QFP Forecasts—2 I/O Ranges
QFN Forecasts—4 I/O Ranges
PGA Forecasts—2 I/O Ranges
BGA Forecasts—3 I/O Ranges
FBGA Forecasts—5 I/O Ranges
WLP Forecasts—4 I/O Ranges
DCA Forecasts—5 I/O Ranges
Total IC Packaging Revenue
Contractor Total Forecast
Contractor DIP Forecast
Contractor SOT Forecast
Contractor SO Forecast
Contractor TSOP Forecast
Contractor DFN Forecast
Contractor CC Forecast
Contractor QFP Forecast
Contractor QFN Forecast
Contractor PGA Forecast
Contractor BGA Forecast
Contractor FBGA Forecast
Contractor WLP Forecast
Packaging Contractor Rankings
Price $2995—Published June 2010, 442 pages
Download brochure with order form
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