New Report on IC Packaging, Released May 2011

The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upward. The downturn of 2009 reversed itself by the second half of the year, catapulting the industry into a year of tremendous growth in 2010.

The recently released report, The Worldwide IC Packaging Market, 2011 Edition, offers an in-depth look at the worldwide integrated circuit (IC) packaging market. Forecasts of units, revenue, and ASP for individual IC device markets are provided from 2010 through 2015. The package solutions for each of these markets are then forecast, broken down into I/O ranges. In a separate chapter, the package types are first combined to deliver an overall worldwide forecast of IC packages, then divided into 12 different package families, plus bare die solutions. The major package families include:

•   Dual in-line package (DIP)

•    Small outline transistor (SOT)

•    Small outline (SO)

•    Thin small outline package (TSOP)

•    Dual flat pack no lead (DFN)

•    Chip carrier (CC)

•    Quad flat pack (QFP)

•    Quad flat pack no lead (QFN)

•    Pin grid array (PGA)

•    Ball grid array (BGA)

•    Fine-pitched ball grid array (FBGA)

•    Wafer-level package (WLP)

Additionally, unit forecasts for die mounted using direct chip attach (DCA) methods were developed. DCA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is derived by multiplying worldwide units with pricing information supplied by contract IC package assemblers.

The contract IC packaging market forecast is supplied in a separate chapter. Units and revenue are analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are provided.The report contains a chapter on the state of the industry.

The purpose of the report is to aid companies associated with the IC packaging market in forecasting demand for their own products. The IC packaging market is evolving to keep pace with other changing markets. IC packaging demand is affected by changes in the die contained in the packages, and by performance expectations of the final product purchased at the consumer level. Through extensive primary and secondary research, this report presents an objective look at the world of IC packaging.

For more information, see, or contact Karen Williams, at